Rapid-Rate Thermal Cycle Chamber (ESS Chamber)
Product Introduction
ESS Chamber is used to evaluate the integrity of thermal mechanical properties of product after exposure to rapid change of ambient temperature. Normally the temperature change rate is less than 20C/min, which can simulate the fastest temperature changing rate in real-world environment condition.
The chamber is used for the screening test and failure mode evaluation of photoelectric components, interconnection circuits, component units and electronics devices.
Test Standard
IEC 60068-2-14: 2009 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature
ESS Chamber is used to evaluate the integrity of thermal mechanical properties of product after exposure to rapid change of ambient temperature. Normally the temperature change rate is less than 20C/min, which can simulate the fastest temperature changing rate in real-world environment condition.
The chamber is used for the screening test and failure mode evaluation of photoelectric components, interconnection circuits, component units and electronics devices.
Test Standard
IEC 60068-2-14: 2009 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature
Standard Chamber Size Chart
Model |
HD-E708-100 |
HD-E708-150 |
HD-E708-225 |
Internal Dimension (W*D*H) |
400*500*500mm |
500*500*600mm |
500*600*750mm |
External Dimension |
600*1080*1380mm |
700*1080*1480mm |
600*1180*1630mm |
Technical specification
Temperature Range |
0°C/-20°C/-40°C/-70°C ~ 150°C |
Temperature Accuracy |
0.01°C |
Temperature Uniformity |
≤ ± 2.0°C |
Temperature deviation |
±0.5°C ~ ±0.2°C (without load) |
Heating Speed |
1°C/min ~ 10°C/min; can be customized |
Cooling Speed |
1°C/min ~ 10°C/min; can be customized |
Humidity Range |
20%RH ~ 98%RH |
Humidity Resolution |
0.1%RH |
Humidity Uniformity |
±3%RH (without load) |
